ANSYS Electronics 2021 R2

With our solutions, we help you solve the most critical aspects of your product designs through simulation. If you work with antenna, RF, microwave, PCB, package, IC design or even an electromechanical device, we provide you with the industry gold standard simulators. These solutions help you solve any electromagnetic, temperature, SI, PI, parasitic, cabling and vibration challenges in your designs. We build on this with complete product simulation, allowing you to achieve first pass success designing an airplane, car, cellphone, laptop, wireless charger, or any other system.

The Ansys Electronics Desktop (AEDT) is a platform that enables true electronics system design. AEDT provides access to the Ansys gold-standard electromagnetics simulation solutions such as Ansys HFSS, Ansys Maxwell, Ansys Q3D Extractor, Ansys SIwave, and Ansys Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, it also includes direct links to the complete Ansys portfolio of thermal, fluid, and mechanical solvers for comprehensive Multiphysics analysis. Tight integration among these solutions provides the user with unprecedented ease of use for setup and faster resolution of complex simulations for design and optimization.

A 3D electromagnetic field solver to design high-frequency and high-speed electronic components. Its FEM, IE, asymptotic and hybrid solvers address RF, microwave, IC, PCB and EMI problems.

Solves multi-layer packages3D layout workflow for PCBs and packagesHigh-frequency electromagnetic solversIP protection through 3D components

A specialized tool for simulating power and signal integrity as well as EMI analysis of IC/PCB packages. Solve for power delivery systems and high-speed channels in electronic devices.

Electrothermal and mechanical analysisIBIS and IBIS-AMI SerDes analysisVirtual complianceImpedance, crosstalk and EMI scanningAutomated decoupling capacitor Optimization

A computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies, enclosures and power electronics.

Unstructured, body-fitted meshingBuilt-in high-fidelity CFD solverComprehensive thermal reliability solutionIndustry leading multiscale multiphysicsBoard-level electrothermal couplingExtensive libraries for thermal physics